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Rogers PCB Board 35UM Copper Thickness Ideal for Microwave Electronics and Signal Processing

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Rogers PCB Board 35UM Copper Thickness Ideal for Microwave Electronics and Signal Processing

Place of Origin : China

Certification : ISO9001

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Packaging Details : Vacuum package

TYPE : Rogers printed circuit PCB

Layers : 2 Layer

Surface Finishing : ENIG

Cu Thk : 35UM

Smt Efficiency : BGA.QFP.SOP.QFN.PLCC.CHIP

Dielectricconstant : 2.2 To 10.2

Soldermask : Green

Thermalconductivity : 0.6 To 0.9 W/mK

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Product description:

Rogers PCB refers to printed circuit boards fabricated using high-performance dielectric laminates developed and produced by Rogers Corporation, a global leader in advanced electronic materials. Unlike standard PCBs made from conventional FR-4 epoxy glass fiber, Rogers materials are specialized engineered solutions designed explicitly for high-frequency, high-speed, and high-reliability electronic applications.


Core Characteristics

Exceptional Dielectric Properties

Stable Dielectric Constant (Dk): Maintains a consistent Dk across a wide frequency range (from RF to millimeter-wave) and varying temperatures, ensuring precise impedance control and signal predictability.
Ultra-Low Dissipation Factor (Df): Minimizes signal attenuation (insertion loss) and energy loss as heat, preserving signal strength and integrity critical for high-frequency performance.


Superior Thermal & Mechanical Stability

Low Thermal Expansion: Coefficient of Thermal Expansion (CTE) closely matches that of copper foil, reducing stress and ensuring reliable via connections during thermal cycling.
Low Moisture Absorption: Exhibits minimal water uptake, preventing degradation of electrical performance in humid or harsh environments.
High Thermal Conductivity: Efficiently dissipates heat, making it ideal for high-power RF and microwave circuits.

Common Material Series

RO4000® Series (e.g., RO4350B, RO4003C): Glass-reinforced hydrocarbon ceramic laminates. Cost-effective with excellent RF performance, widely used in 5G base stations, automotive radar, and RF modules.
RO3000® Series (e.g., RO3003, RO3035): Ceramic-filled PTFE composites. Designed for millimeter-wave applications (e.g., 77GHz automotive radar) offering extremely low loss.
RT/duroid® Series: PTFE-based materials providing the lowest loss for extreme high-frequency and aerospace applications.


Primary Applications

Rogers PCBs are the material of choice for mission-critical systems where performance cannot be compromised:

Telecommunications: 5G/6G antennas, power amplifiers, base stations, and microwave radio links.
Aerospace & Defense: Radar systems, satellite communications, avionics, and electronic warfare.
Automotive: Advanced Driver Assistance Systems (ADAS), 77/79GHz radar sensors.
Industrial & Medical: High-speed test equipment, medical imaging (MRI), and satellite communications.
In summary, Rogers PCB represents the gold standard for high-frequency circuit board materials, enabling the reliable operation of cutting-edge technologies by delivering unparalleled electrical performance and environmental stability.

Technical Parameters:

Product Name Rogers PCB
Type Hybrid Stack Up Board
Surface Finishing HASL / HASL Lead Free / Immersion Gold / ENIG
Dielectric Constant 2.2 to 10.2
Material Arlon 85N
Multilayer Stack Up Stack Up, Control Impedance
SMT Efficiency BGA, QFP, SOP, QFN, PLCC, CHIP
Coefficient of Thermal Expansion 10 to 17 ppm/°C





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